AI
IBM Siemens Nanostack Research Targets 3D Chip Scaling
IBM and Siemens started new research to advance 3D nanostack transistors through chip-design, simulation and manufacturing software.
IBM and Siemens started new research to advance 3D nanostack transistors through chip-design, simulation and manufacturing software.
NVIDIA introduced new CUDA-X tools for AI-defined fabs, with partners reporting chip simulation, inspection and engineering speed gains.
GlobalFoundries will operate two planned New York semiconductor fabs under a U.S.-Japan initiative worth up to $21 billion.